Part Number Hot Search : 
MAX30 AC1506 10A45 MICRORAM GS2GIF 74AHC14 C1H10 OM9369SP
Product Description
Full Text Search
 

To Download HD74CDC2510B Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HD74CDC2510B
3.3-V Phase-lock Loop Clock Driver
REJ03D0826-0900 (Previous: ADE-205-219G) Rev.9.00 Apr 07, 2006
Description
The HD74CDC2510B is a high-performance, low-skew, low-jitter, phase-lock loop clock driver. It uses a phase-lock loop (PLL) to precisely align, in both frequency and phase, the feedback (FBOUT) output to the clock (CLK) input signal. It is specifically designed for use with synchronous DRAMs. The HD74CDC2510B operates at 3.3 V VCC and is designed to drive up to five clock loads per output. Bank of outputs provide ten low-skew, low-jitter copies of the input clock. Output signal duty cycles are adjusted to 50 percent independent of the duty cycle at the input clock. Bank of outputs can be enabled or disabled via the control (G) inputs. When the G inputs are high, the outputs switch in phase and frequency with CLK; when the G inputs are low, the outputs are disabled to the logic-low state. Unlike many products containing PLLs, the HD74CDC2510B does not require external RC networks. The loop filter for the PLL is included on-chip, minimizing component count, board space, and cost. Because it is based on PLL circuitry, HD74CDC2510B requires a stabilization time to achieve phase lock of the feedback signal to the reference signal. This stabilization time is required, following power up and application of a fixed-frequency, fixed-phase signal at CLK, as well as following any changes to the PLL reference or feedback signals. The PLL can be bypassed for test purposes by strapping AVCC to ground.
Features
* * * * * * Meets "PC SDRAM registered DIMM design support document, Rev. 1.2" Phase-lock loop clock distribution for synchronous DRAM applications External feedback (FBIN) pin is used to synchronize the outputs to the clock input No external RC network required Support spread spectrum clock (SSC) synthesizers Ordering Information
Part Name HD74CDC2510BTEL Package Type TSSOP-24 pin Package Code (Previous code) PTSP0024JB-A (TTP-24DBV) T Package Abbreviation Taping Abbreviation (Quantity) EL (1,000 pcs / Reel)
*Only by a change of a suffix (A to B) for standardization, there isn't any change of the product.
Function Table
Inputs G X L H High level Low level Immaterial CLK L H H 1Y (0:9) L L H Outputs FBOUT L H H
H: L: X:
Rev.9.00 Apr 07, 2006 page 1 of 7
HD74CDC2510B
Pin Arrangement
AGND 1
24 CLK 23 AVCC 22 VCC 21 1Y9 20 1Y8 19 GND 18 GND 17 1Y7 16 1Y6 15 1Y5
14 VCC 13 FBIN
VCC
2
1Y0 3 1Y1 4 1Y2 5 GND GND
6 7
1Y3 8 1Y4
9
VCC 10
G 11 FBOUT 12
(Top view)
Absolute Maximum Ratings
Item Supply voltage Input voltage *1 Output voltage *1, 2 Input clamp current Output clamp current Continuous output current Supply current Maximum power dissipation *3 at Ta = 55C (in still air) Storage temperature Notes: Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 4.6 -0.5 to 6.5 -0.5 to VCC +0.5 -50 50 50 100 0.7 -65 to +150 Unit V V V mA mA mA mA W C Conditions
VI < 0 VO < 0 or VO > VCC VO = 0 to VCC
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 750 mils.
Rev.9.00 Apr 07, 2006 page 2 of 7
HD74CDC2510B
Recommended Operating Conditions
Item Supply voltage Input voltage Symbol VCC VIH VIL VI IOH IOL Ta Min 3.0 2.0 -- 0 -- -- 0 Typ -- -- -- -- -- -- -- Max 3.6 -- 0.8 VCC -12 12 85 Unit V V Conditions
Output current Operating temperature
mA C
Note: Unused inputs must be held high or low to prevent them from floating.
Logic Diagram
G
11
3 4
5
8
9
1Y0 1Y1
1Y2
1Y3
1Y4
15 16
17
1Y5 1Y6
1Y7
1Y8
1Y9
FBOUT
CLK
FBIN AVCC
24
20
PLL
13
21
23
12
Rev.9.00 Apr 07, 2006 page 3 of 7
HD74CDC2510B
Pin Function
Pin name CLK No. 24 I Type Description Clock input. CLK provides the clock signal to be distributed by the HD74CDC2510B clock driver. CLK is used to provide the reference signal to the integrated PLL that generates the clock output signals. CLK must have a fixed frequency and fixed phase for the PLL to obtain phase lock. Once the circuit is powered up and a valid CLK signal is applied, a stabilization time is required for the PLL to phase lock the feedback signal to its reference signal. Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be hard-wired to FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so that there is nominally zero phase error between CLK and FBIN. Output bank enable. G is the output enable for outputs 1Y(0:9). When G is low, outputs 1Y(0:9)are disabled to a logic-low state. When G is high, all outputs 1Y(0:9) are enabled and switch at the same frequency as CLK. Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency as CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL. Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y(0:9) is enabled via the G input. These outputs can be disabled to a logic low state by deasserting the G control input. Analog power supply. AVCC provides the power reference for the analog circuitry. In addition, AVCC can be used to bypass the PLL for test purposes. When AVCC is strapped to ground, PLL is bypassed and CLK is buffered directly to the device outputs. Analog ground. AGND provides the ground reference for the analog circuitry. Power supply Ground
FBIN
13
I
G
11
I
FBOUT
12
O
1Y(0:9)
AVCC
3, 4, 5, 8, 9, O 15, 16, 17, 20, 21 23 Power
AGND VCC GND
1
Ground
2, 10, 14, 22 Power 6, 7, 18,19 Ground
Electrical Characteristics
Item Input clamp voltage Output voltage Symbol VIK VOH Min -- VCC-0.2 2.1 2.4 -- -- -- -- -- -- Typ *1 -- -- -- -- -- -- -- -- -- -- Max -1.2 -- -- -- 0.2 0.8 0.55 5 10 500 Unit V V Test Conditions VCC = 3 V, II = -18 mA VCC = Min to Max, IOH = -100 A VCC = 3 V, IOH = -12 mA VCC = 3 V, IOH = -6 mA VCC = Min to Max, IOL = 100 A VCC = 3 V, IOL = 12 mA VCC = 3 V, IOL = 6 mA VCC = 3.6 V, VIN = VCC or GND AVCC = GND, VCC = 3.6 V, VI = VCC or GND, IO = 0 AVCC = GND, VCC = 3.3 to 3.6 V One input at VCC-0.6 V, Other inputs at VCC or GND VCC = 3.3 V, VI = VCC or GND VCC = 3.3 V, VO = VCC or GND
VOL
Input current Quiescent supply current
IIN ICC ICC
A A A
Input capacitance Output capacitance Note:
CIN CO
-- --
4 6
-- --
pF pF
1. For conditions shown as Min or Max, use the appropriate value specified under recommended operating conditions.
Rev.9.00 Apr 07, 2006 page 4 of 7
HD74CDC2510B
Switching Characteristics
(CL = 30 pF, Ta = 0 to 85C)
Item Phase error time Symbol tpe VCC = 3.3 V0.3 V Min Typ Max -150 -- 150 Unit ps From (Input) 66 MHz < CLKIN 100 MHz To (Output) FBIN
Between output pins skew *1
tsk (O)
--
--
200
ps
Any Y or FBOUT, Any Y or FBOUT F (clkin = 100 MHz) F (clkin = 100 MHz) F (clkin = 100 MHz) Any Y or FBOUT Any Y or FBOUT Any Y or FBOUT Any Y or FBOUT AVCC
Cycle to cycle jitter Duty cycle Output rise / fall time Analog power supply rejection (DC to 10 MHz) Notes: tTLH tTHL Vapsr
*2
-100 45 5.0 5.0 100
-- -- -- -- --
100 55 1.0 1.0 --
ps % volts/ns mVP-P
The specifications for parameters in this table are applicable only after any appropriate stabilization time has elapsed. 1. The tsk(O) specification is only valid for equal loading of all outputs. 2. This parameter is characterized but not tested.
Timing Requirements
Item Input clock frequency Input clock duty cycle Stabilization time *1 Note: Symbol fclock Min 50 40 -- Max 125 60 1 Unit MHz % ms Test Conditions
After power up
1. Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. In order for phase lock to be obtained, a fixed-frequency, fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation delay and skew parameters given in the switching characteristics table are not applicable.
Test Circuit
From output under test
*1
C L = 30 pF
500
Note:
1. CL includes probe and jig capacitance.
Rev.9.00 Apr 07, 2006 page 5 of 7
HD74CDC2510B Waveforms - 1
3V
Input
50% VCC
50% VCC 0V
Output (= FBOUT)
2V
50% VCC 0.4 V
2V 0.4 V tTHL
VOH VOL
tTLH
Notes:
1. All input pulses are supplied by generators having the following characteristics: PRR 100 MHz, ZO = 50 , tr = 1.2 ns, tf = 1.2 ns. 2. The outputs are measured one at a time with one transition per measurement.
Waveforms - 2
CLKIN
t phase error
FBIN
FBOUT
t sk (o)
Any Y
Any Y
t sk (o)
Any Y
Rev.9.00 Apr 07, 2006 page 6 of 7
HD74CDC2510B
Package Dimensions
JEITA Package Code P-TSSOP24-4.4x7.8-0.65 RENESAS Code PTSP0024JB-A Previous Code TTP-24DBV MASS[Typ.] 0.08g
*1
D
F 13
24
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
*2
Index mark
Terminal cross section ( Ni/Pd/Au plating )
1 12
e
*3
c
Reference Dimension in Millimeters Symbol
Z
bp
x
M
L1
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 7.80 8.10 4.40
0.03 0.07 0.10 1.10 0.15 0.20 0.25 0.10 0.15 0.20 0 8 6.20 6.40 6.60 0.65 0.13 0.10 0.65 0.4 0.5 0.6 1.0
Rev.9.00 Apr 07, 2006 page 7 of 7
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


▲Up To Search▲   

 
Price & Availability of HD74CDC2510B

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X